Intel’s Meteor Lake, Its First PC Chips With TSMC Tech, Launch This Yr


(Picture credit score: Intel)

Throughout its Q1 2023 earnings, Intel introduced that it’s ramping manufacturing wafers for its Meteor Lake processors for a launch within the second half of this yr. These chips can be partially fabbed on the ‘Intel 4’ course of node, a key milestone for the corporate as it really works in direction of delivering 5 nodes in 4 years — a aim that the CEO Pat Gelsiner reiterated continues to be on observe. Intel says that two of these 5 nodes are nearly full. Notably, the Meteor Lake processors are Intel’s first desktop PC chips that may also use parts fabbed on TSMC’s course of nodes.

Intel additionally says that its Arrow Lake and Lunar Lake merchandise stay on schedule to launch in 2024. Intel will use its 3D Foveros packaging tech because the bedrock for the buyer market’s Meteor Lake, Arrow Lake, and Lunar Lake processors. This expertise permits Intel to stack chiplets vertically atop one unifying base die with a Foveros interconnect. You’ll be able to learn extra about that expertise right here. 

Not solely will Meteor Lake signify the primary chips with the Intel 4 course of node, a vital step for Intel because it appears to proper the ship, however they may also be the primary Intel desktop PC chips that use course of node tech from TSMC.

As you may see within the desk under, Meteor Lake’s new design will use a number of completely different course of nodes in the identical chip bundle. On this case, three tiles (just like chiplets) use TSMC course of nodes – the GPU, SOC, and IOE tiles.

This system affords price benefits, because the bigger, older TSMC nodes can be utilized for capabilities that are not as delicate to efficiency. Offloading these capabilities from the CPU tile additionally improves yield, and thus price, for this vital element. You’ll be able to learn the deep-dive particulars of the Intel 4 course of right here.

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Intel Meteor Lake Tile/Chiplet Producer / Node
CPU Tile Intel / ‘Intel 4’
3D Foveros Base Die Intel / 22FFL (Intel 16)
GPU Tile (tGPU) TSMC / N5 (5nm)
SoC Tile TSMC / N6 (6nm)
IOE Tile TSMC / N6 (6nm)